Forth the high-end chipset industry, MediaTek is putting in a lot of effort to compete with Qualcomm. The Dimensity 8000, 8100, and 9000 are slated to launch shortly with flagship-level performance, but the greatest part is that the D8000 and D8100 are aimed at mid-range and high-end phones, respectively.
Digital Chat Station, a Chinese tipster, has previously divulged a few details about the D8100, and he has done so again. According to him, the flagship-grade processor will be manufactured using TSMC’s 5nm technology and would support UFS 3.1 and LPDDR5 memory. There will be four 2.85GHz Cortex A78 CPU cores and four 2.0GHz Cortex A55 CPU cores.
According to the tipster, the GPU will be a G510 MC6, however others have speculated that it would be the G610 MC6.
The Dimensity 8100 will be on par with the Snapdragon 888/888+ in terms of overall performance, thanks to the GPU. The processor scores 170 frames per second in the GFX Bench ES 3.0 Manhattan test, putting it in the same league as Qualcomm’s last-gen flagship SoC.
As previously said, the D8100 is expected to appear in mid-range and high-end phones in 2022. Digital Chat Station has stated that it will open in March of this year, but there has been no formal confirmation.